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Floor To Cloud™ – The Future of Automation

Visit us at PACK EXPO (Booth N-5345) to learn how our automation solutions can transform your business.

Elevate your food & beverage operations with data-driven insights

Join us at PACK EXPO, Booth N-5345, and discover how our Floor to Cloud approach can revolutionize your packaging operations. Our data-driven solutions offer the insights needed to enhance manufacturing efficiency, improve OEE, and achieve sustainability targets. Experience how Emerson’s innovation can elevate your production lines and factories. Transform your operations today!

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Are You Ready to Unlock New Levels of Performance?

PACK EXPO Events Schedule

7:15 AM

Women’s Leadership Breakfast
Packaging & Processing Women’s Leadership Network Breakfast

Location: McCormick Place, West Building, Room W-375 | Duration: 1 hour and 45 minutes

Registered attendees of PACK EXPO International are invited to the annual PPWLN Breakfast. Here from Lisa Sun, founder and CEO of retail brand and lifestyle company GRAVITAS. Listen to inspiring stories and get practical tips to motivate you to step up and stand out in your career.

9:00 AM

The Amazing Packaging Race
2024 Amazing Packaging Race

Location: McCormick Place, 2301 S King Dr, Chicago, 60616 | Duration: 5 hours

Designed to attract the next generation of packaging professionals, this competition features student teams tackling challenges set by exhibitors across all four halls of the show floor. It culminates on November 6th with prize presentations to the top 3 teams. Emerson has been a proud sponsor of this event for over a decade.

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